Plenary Talk I  Chair: Mitsumasa Koyanagi - Tohoku University;

3D Stacked Imager  Chair: Makoto Motoyoshi - Tohoku-MicroTec Co., Ltd; Tetsu Tanaka - Tohoku University;

Intergration Technology I  Chair: Murugesan Mariappan - Tohoku University; Chuan Seng Tan - Nanyang Technological University;

Plenary Talk II  Chair: Paul Franzon - NC State University;

Plenary Talk III  Chair: Peter Georg Ramm - Fraunhofer EMFT;

Integration Technology II  Chair: Shoso Shingubara - Kansai University; Takafumi Tak Fukushima - Tohoku University;

Memory System  Chair: Makoto Nagata - Kobe University; Takayuki Ohba - Tokyo Institute of Technology;

Monolithic/Hetero Integration  Chair: Hisashi Kino - Tohoku University; Akihiro Noriki - National Institute of Advanced Industrial Science and Technology;

Panel Session  Chair: None

Special Session  Chair: Tetsu Tanaka - Tohoku University;

3D Design  Chair: Jubee Tada - Yamagata University; Pascal Vivet - CEA-Leti;

Direct/Hybrid Bonding  Chair: Fumihiro Inoue - imec; Sarah Eunkyung Kim - Seoul National University of Science and Technology;

Thermal Management  Chair: Takafumi Tak Fukushima - Tohoku University; Shinichi Ogawa - National Institute of Advanced Industrial Science and Technology;

Poster Session  Chair: None