Packaging Circuits to Make Small and Reliable Products Session
Session Type:
Lecture
Session Code:
IS15
Location:
R01
Date & Time:
Wednesday March 18, 2020 (14:30 - 17:35)
Chair:
Brian Narveson
Papers are listed in the order they will be presented.
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Paper
Id
Topic
Title/Author
3559
1
Thermal Packaging Challenges for Next-Generation Power Electronics
Ercan Dede
3560
1
Full 3D Advanced Packaging Concepts for Wide Bandgap Power Electronics
Jean-Luc Schanen, Y. Avenas, PO. Jeannin
3561
1
Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates
Douglas Hopkins, Tuz-Hsuan Cheng
3562
1
5G Is Broken and the Heatsink Is to Blame
Doug Kirkpatrick, Brian Zahnstecher
3563
1
System-Level Design Considerations for Performance Enhancing SiC Power Modules
Ty McNutt
3564
1
Reliability of Thermally Integrated 3D Power Packaging
Patrick McCluskey
3565
1
Using Advanced Manufacturing Techniques for Thermal Management of High-Reliability Power Components
Jens Eltze
