Packaging Circuits to Make Small and Reliable Products Session
Session Type: Lecture
Session Code: IS15
Location: R01
Date & Time: Wednesday March 18, 2020 (14:30 - 17:35)
Chair: Brian Narveson


    Papers are listed in the order they will be presented.

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3559 1 Thermal Packaging Challenges for Next-Generation Power Electronics
Ercan Dede
3560 1 Full 3D Advanced Packaging Concepts for Wide Bandgap Power Electronics
Jean-Luc Schanen, Y. Avenas, PO. Jeannin
3561 1 Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates
Douglas Hopkins, Tuz-Hsuan Cheng
3562 1 5G Is Broken and the Heatsink Is to Blame
Doug Kirkpatrick, Brian Zahnstecher
3563 1 System-Level Design Considerations for Performance Enhancing SiC Power Modules
Ty McNutt
3564 1 Reliability of Thermally Integrated 3D Power Packaging
Patrick McCluskey
3565 1 Using Advanced Manufacturing Techniques for Thermal Management of High-Reliability Power Components
Jens Eltze