Session Index

Lecture Sessions
Wednesday April 24, 2019 (09:35-10:20)

Silicon Carbide for Power Devices: History, Evolution, Applications, and Prospects  Chair: Ahmed Elasser - GE;

Wednesday April 24, 2019 (10:45-11:30)

Electrification Challenges in Aeronautics  Chair: Christophe Lochot - Airbus;

Wednesday April 24, 2019 (13:00-15:05)

Systems & Circuits Technical Session  Chair: Jin Wang - Ohio State University; Rolando Burgos - Virginia Tech University;

Wednesday April 24, 2019 (15:30-17:35)

Power Modules Technical Session  Chair: Ty McNutt - Wolfspeed;

Thursday April 25, 2019 (09:35-10:20)

Novel Thermal & Packaging Paradigms for Next-Generation Power Electronics  Chair: Eric Dede - Toyota Research Institute of North America;

Thursday April 25, 2019 (10:45-11:30)

Reliability in Power Electronics Modules  Chair: Laurent Dupont - SATIE-IFSTTAR;

Thursday April 25, 2019 (13:00-15:05)

Packaging & Interconnects Technical Session  Chair: Puqi Ning - Chinese Academy of Sciences; Brian Narveson - PSMA;

Thursday April 25, 2019 (15:30-17:10)

Modeling and Reliability  Chair: Patrick McCluskey - University of Maryland, College Park; David Huitink - University of Arkansas;

Friday April 26, 2019 (08:00-10:05)

Dielectrics and Insulation  Chair: Mona Ghassemi - Virginia Tech University; Davide Fabiani - University of Bologna;

Friday April 26, 2019 (10:15-12:20)

EMI & Parasitic Implications  Chair: Aaron Brovont - University of Alabama; Nicolas Degrenne - Mitsubishi Electric R&D Centre Europe - MERCE;

Friday April 26, 2019 (13:00-14:40)

Thermal Challenges Technical Session  Chair: Lauren Boteler - U. S. Army Research Laboratory; Eric Dede - Toyota Research Institute of North America;

Poster Sessions
Wednesday April 24, 2019 (17:35-19:00)

Posters  Chair: Brandon Passmore - Wolfspeed;