Plenary T1  Chair: Tsuyoshi Funaki - Osaka University; Nobuo Satoh - Chiba Institute of Technology;

Device Structures & Fabrication Techniques  Chair: Wataru Saito - Kyushu University; Kazunori Hasegawa - Kyushu Institute of Technology;

Plenary T2  Chair: Michihiro Shintani - Nara Institute of Science and Technology; Jun-ichi Itoh - Nagaoka University of Technology;

Device Characterisation & Modelling I  Chair: Kazunori Hasegawa - Kyushu Institute of Technology; Wataru Saito - Kyushu University;

Device Characterisation & Modelling II  Chair: Frederic Richardeau - Laplace Laboratory – University of Toulouse – CNRS; Luca Maresca - University of Naples Federico II;

Plenary F1  Chair: Nobuo Satoh - Chiba Institute of Technology; Tsuyoshi Funaki - Osaka University;

Applications I  Chair: Jun Imaoka - Nagoya University; Emre Gurpinar - Oak Ridge National Lab;

Plenary F2  Chair: Jun-ichi Itoh - Nagaoka University of Technology; Michihiro Shintani - Nara Institute of Science and Technology;

Packaging & Passives  Chair: Katsuaki Saito - Hitachi Power Semiconductor Device Ltd.; Antonio Pio Catalano - University of Naples Federico II;

Applications II  Chair: Emre Gurpinar - Oak Ridge National Lab; Jun Imaoka - Nagoya University;

Harsh Environments & SOA  Chair: Luca Maresca - University of Naples Federico II; Alberto Castellazzi - Kyoto University of Advanced Science;

Packaging & Integration  Chair: Antonio Pio Catalano - University of Naples Federico II; Alberto Castellazzi - Kyoto University of Advanced Science;

Applications  Chair: Jun-ichi Itoh - Nagaoka University of Technology; Takashi Sato - Kyoto University;

Devices  Chair: Luca Maresca - University of Naples Federico II; Frederic Richardeau - Laplace Laboratory – University of Toulouse – CNRS;