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Packaging Circuits to Make Small and Reliable Products Session |
Session Type: | Lecture |
Session Code: | IS15 |
Location: | R01 |
Date & Time: | Wednesday March 18, 2020 (14:30 - 17:35) |
Chair: | Brian Narveson |
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Papers are listed in the order they will be presented.
Paper Id | Topic | Title/Author |
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3559 |
1 |
Thermal Packaging Challenges for Next-Generation Power Electronics Ercan Dede |
3560 |
1 |
Full 3D Advanced Packaging Concepts for Wide Bandgap Power Electronics Jean-Luc Schanen, Y. Avenas, PO. Jeannin |
3561 |
1 |
Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates Douglas Hopkins, Tuz-Hsuan Cheng |
3562 |
1 |
5G Is Broken and the Heatsink Is to Blame Doug Kirkpatrick, Brian Zahnstecher |
3563 |
1 |
System-Level Design Considerations for Performance Enhancing SiC Power Modules Ty McNutt |
3564 |
1 |
Reliability of Thermally Integrated 3D Power Packaging Patrick McCluskey |
3565 |
1 |
Using Advanced Manufacturing Techniques for Thermal Management of High-Reliability Power Components Jens Eltze |
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